Sheng-Chih Lin

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Affiliation: 
Intel Corporation
Graduation Time: 
Saturday, December 1, 2007

Sheng-Chih Lin received the B.S. degree in electrical engineering from the National Taiwan University, Taipei, Taiwan, in 1996.  From 1998 to 2002, he was with the Phoenixtec Electronics Company, Ltd., and the CHROMA ATE Inc., respectively, in Taiwan. He joined Prof. Banerjee's  research group at the University of California, Santa Barbara in Winter 2003 and received the PhD degree in electrical and computer engineering in December 2007.  His doctoral thesis focused on the development of a self-consistent thermal profile simulation methodology for nanoscale high-performance ICs and its implications for power and thermal management.  His research also introduced a novel technique by which circuit designers can comprehend the implications of design choices on chip-level thermal management issues including  packaging/cooling solutions and vice-versa. During the summer of 2005 and 2006, he worked as an intern in the Assembly and Test Technology Development of Intel in Chandler, AZ.  His research interests include electrothermal modeling and analysis of integrated circuits, variation-aware circuit design and optimization, and power/thermal management for nanoscale CMOS ICs. During his doctoral work, he authored or coauthored over 15 papers in journals and refereed international conferences as well as a book chapter on thermal issues in 3-D ICs (Springer-Verlag, 2008).  He was also the corecipient of an IEEE Micro Award for a 3D IC related paper  (in ASPLOS 2006) that was selected among the 10 most significant research publications in computer architecture in 2006. At present, he is with the ATD Division of Intel Corporation in Chandler, Arizona, as a Member of Technical Staff.