3D IC

Beyond Moore Devices

Beyond-CMOS nanotransistors and their derivatives including logic and memory devices; 3D integration; Emerging ultra-low power quantum devices including sub kT/q transistors, and spintronics, valleytronics, mottronics devices, for applications in energy-efficient ICs and non-Von Neumann electronics including brain-inspired devices and circuits.

Selected Publications

Jiahao Kang, Wei Cao, Arnab Pal, Sumeet Pandey, Steve Kramer, Richard Hill, Gurtej Sandhu and Kaustav Banerjee
IEEE International Electron Devices Meeting (IEDM), San Francisco, December 2-6, 2017, pp. 31.2.1-31.2.4.

Wei Cao, Wei Liu, Jiahao Kang and Kaustav Banerjee
IEEE Electron Device Letters, Vol. 37, No. 11, pp. 1497-1500, Nov. 2016.

Deblina Sarkar, Xuejun Xie, Wei Liu, Wei Cao, Jiahao Kang, Yongji Gong, Stephan Kraemer, Pulickel M. Ajayan and Kaustav Banerjee
Nature, Vol. 526, pp. 91-95, 2015.
Read Media Coverage by Science DailyIEEE Spectrum and EE Times

Wei Cao, Jiahao Kang, Deblina Sarkar, Wei Liu and Kaustav Banerjee
IEEE Transactions on Electron Devices, Special Issue to commemorate the 60th anniversary of the IEDM, Vol. 62, No. 11, pp. 3459-3469, 2015.

Wei Liu, Jiahao Kang, Deblina Sarkar, Yasin Khatami, Debdeep Jena and Kaustav Banerjee
Nano Letters, Vol. 13, no. 5, pp. 1983-1990, 2013.
Read Media Coverage by Science Daily